专利名称：Producing method of suspension board with
circuit
发明人：Takahiko Yokai,Yasunari Ooyabu,Toshiki
Naito
申请号：US12216589申请日：20080708公开号：US08647517B2公开日：20140211
专利附图：
摘要：A producing method of a suspension board with circuit includes simultaneouslyforming a conductive pattern formed on an insulating layer formed on a metal
supporting board and having a terminal portion for connecting to an electronic
component, and a mark formed on the metal supporting board, or on the insulating layerand having an opening for forming a reference hole for mounting the electroniccomponent, and forming the reference hole by etching the metal supporting boarddisposed in the opening of the mark, or the insulating layer and the metal supportingboard each disposed in the opening of the mark.
申请人：Takahiko Yokai,Yasunari Ooyabu,Toshiki Naito
地址：Osaka JP,Osaka JP,Osaka JP
国籍：JP,JP,JP
代理机构：Edwards Neils PLLC
代理人：Jean C. Edwards, Esq.
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