Alignment Method and Apparatus

专利名称：Alignment Method and Apparatus发明人：Sebastianus Adrianus GOORDEN,Simon

Reinald HUISMAN

申请号：US17049597申请日：20190402

公开号：US20210240091A1公开日：20210805

专利附图：

摘要：A method of determining a position of a feature (for example an alignmentmark) on an object (for example a silicon wafer) is disclosed. The method comprisesdetermining an offset parameter, determining the second position; and determining afirst position from the second position and the offset parameter, the position of themark being the first position. The offset parameter is a measure of a difference in: a firstposition that is indicative of the position of the feature; and a second position that isindicative of the position of the feature. The offset parameter may be determined using afirst measurement apparatus and the second position may be determined using a second,

different measurement apparatus.

申请人：ASML Netherlands B.V.

地址：Veldhoven NL

国籍：NL

更多信息请下载全文后查看