专利名称：Collet cleaning method and die bonder
using the same
发明人：Yoshihide Ishii,Hiroshi Maki申请号：US14104705申请日：20131212公开号：US09318361B2公开日：20160419
专利附图：
摘要：An object of the present invention is to provide a collet cleaning method and adie bonder using the same in which a collet can be cleaned without adding a new unit, andforeign substances with 5 high adhesive power can be reliably removed without
scattering the foreign substances. A die bonder includes a pickup device, a bonding headunit having a collet that absorbs dies from a wafer at the timing of lifting of the pickupdevice, and a control unit that controls the pickup device and the bonding head unit. Thecollet is moved to a position of a dicing tape at which no dies of the wafer held by a waferring exist to be brought into contact with the adhesive surface of the dicing tape, so thatforeign substances attached to the tip end of the collet are removed.
申请人：Fasford Technology Co., Ltd.
地址：Minami-Alps, Yamanashi JP
国籍：JP
代理机构：Crowell & Moring LLP
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