WAFER CARRIER WITH VARYING THERMAL RESISTANCE

专利名称：WAFER CARRIER WITH VARYING THERMAL

RESISTANCE

发明人：VOLF, BORIS,SODERMAN, BREID,ARMOUR,

ERIC, A.

申请号：US2009004931申请日：20090828

公开号：WO2010024943A3公开日：20100617

摘要：In chemical vapor deposition apparatus, a wafer carrier (32) has a top surface(34) holding the wafers and a bottom surface (36) heated by radiant heat transfer from aheating element (28). The bottom surface (36) of the wafer carrier is non-planar due tofeatures such as depressions (54) so that the wafer carrier has different thickness atdifferent locations. The thicker portions of the wafer carrier have higher thermalresistance. Differences in thermal resistance at different locations counteract undesirednon-uniformities in heat transfer to the wafer. The wafer carrier may have pockets withprojections (553, 853) for engaging spaced-apart locations on the edges of the wafer.

申请人：VEECO INSTRUMENTS INC.,VOLF, BORIS,SODERMAN, BREID,ARMOUR, ERIC, A.

代理人：MILLET, Marcus, J. et al.

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