专利名称：Lubricating fluids for slicing silicon ingots发明人：Charles C. Payne,Earnest M. Kerr申请号：US07/312012申请日：19890216公开号：US04853140A公开日：19890801
摘要：A lubricating composition for use in slicing or cutting silicon wafers. Thecomposition includes a soap, a phosphorous containing compound, and an ethyleneoxide-propylene oxide polymer. The phosphorous compound is a low temperature,extreme pressure lubricant. The ethylene oxide propylene oxide polymer is a hightemperature, extreme pressure lubricant. Suitable soaps include C6-C18 fatty acidsreacted with triethanolamine or aminoethanolamine. Additionally, biocides or fungicidesmay be added. Also an antifoam and a complexing aid such as EDTA may be used.
申请人：NALCO CHEMICAL COMPANY
代理人：John G. Premo,Anthony L. Cupoli,Donald G. Epple
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