CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM

专利名称：CHIP-TO-CHIP MULTI-SIGNALING

COMMUNICATION SYSTEM WITHCOMMON CONDUCTIVE LAYER

发明人：Chau-Chin SU,Ying-Chieh Ho,Po-Hsiang

Huang

申请号：US13210818申请日：20110816

公开号：US20120091596A1公开日：20120419

专利附图：

摘要：A chip-to-chip multi-signaling communication system with common conductive

layer, which comprises a first chip, a second chip, and a common conductive layer, isdisclosed. The first chip has at least a first metal pad and a second metal pad. The secondchip has at least a first metal pad and a second metal pad. The common conductive layeris to a conductive material and glued directly to the first chip and the second chip.Wherein, the first metal pad of the second chip is aligned with the first metal pad of thefirst chip for receiving the signal from the first metal pad of the first chip through thecommon conductive layer. The interference generated by other pads of the first and thesecond chips is suppressed by the design of the pads and the common conductive layer.

申请人：Chau-Chin SU,Ying-Chieh Ho,Po-Hsiang Huang

地址：Taipei City TW,Zhubei City TW,Tainan City TW

国籍：TW,TW,TW

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