专利名称：Method for encapsulating IC packages with
diamond substrate
发明人：Gerald K. Fehr申请号：US09/157750申请日：19980921公开号：US06058602A公开日：20000509
摘要：A method for manufacturing a plastic encapsulated integrated circuit (IC)package has steps for placing a diamond substrate in a lower cavity of an encapsulationmold such that the diamond substrate in the finished package underlies the die attachpad and a portion of the leads in close proximity to each. Pins are provided in lowercavities of molds to support and/or position diamond substrates to lie close to both dieattach pads and leads to facilitate efficient heat transfer from an operating IC, throughthe die attach pad, into and through the diamond substrate, and finally to the leadsleading from the encapsulated package. Apparatus is disclosed for positioning andsupporting diamond substrates, and combination heat slugs for the purpose aredisclosed, having diamond substrates bonded to metal slugs.
申请人：INTEGRATED PACKAGING ASSEMBLY CORPORATION
代理人：Donald R.Central Coast Patent Agency Boys
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