元器件交易网www.cecb2b.comMOTOROLASEMICONDUCTOR TECHNICAL DATAOrder this documentby DTA114GE/DProduct PreviewGeneral Purpose TransistorPNP Bipolar Junction Transistorwith a 10 kW Base–Emitter ResistorMAXIMUM RATINGS (TJ = 25°C unless otherwise noted)RatingCollector–Emitter VoltageCollector–Base VoltageEmitter–Base VoltageCollector CurrentBase CurrentTotal Power Dissipation @ TC = 25°CTotal Power Dissipation @ TC = 85°CThermal Resistance — Junction to Ambient (1)Operating and Storage Temperature Range1.Minimum FR–4 or G–10 PCB, Operating to Steady State.SymbolVCEOVCBOVEBOICIBPDPDRqJAValue50505.01002015078833–55 to 150UnitVVVmAmAmWmW°C/W°CDTA114GE50 Volts100 mAmps150 mW321CASE 463–01SOT–416/SC–90COLLECTOR (3)BASE (1)RBEEMITTER (2)RBE = 10 kWELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)CharacteristicOFF CHARACTERISTICSCollector–Emitter Breakdown Voltage(IC = 50 µAdc)Collector–Emitter Breakdown Voltage(IC = 1.0 mAdc)Collector–Emitter Breakdown Voltage(IE = 720 mAdc)Collector Cutoff Current(VCB = 50 Vdc, IE = 0 Adc)Emitter Cutoff Current(VEB = 4.0 Vdc, IC = 0 Adc)ON CHARACTERISTICSDC Current Gain(VCE = 5.0 Vdc, IC = 5.0 mAdc)Collector–Emitter Saturation Voltage(IC = 10 mAdc, IB = 500 mAdc)hFEVCE(sat)30————Vdc0.3BVCBOBVCEOBVEBOICBOIEBOVdc50505.0—300——————Vdc—Vdc—mAdc0.5mAdc580SymbolMinTypMaxUnitThis document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.Thermal Clad is a trademark of the Bergquist CompanyMotorola Small–Signal Transistors, FETs and Diodes Device Data© Motorola, Inc. 1998 1元器件交易网www.cecb2b.comDTA114GETYPICAL ELECTRICAL CHARACTERISTICS0.40.18IC/IB = 10VCE(sat), VOLTAGE (V)VCE(sat), VOLTAGE (V)0.30.12T = 85°C25°C0.060°C0.250 mA0.1IC = 1.0 mA0.010.11.0IB, BASE CURRENT (mA)1010 mA100 mA010001.010IC, COLLECTOR CURRENT (mA)100Figure 1. Collector–Emitter Saturation VoltageFigure 2. Collector–Emitter Saturation Voltage1.0VBE(sat)1000VCE = 1.0 VhFE, DC CURRENT GAIN25°C150°C100–40°CVOLTAGE (V)0.1VCE(sat)0.01IC/IB = 101.010IC, COLLECTOR CURRENT (mA)100101.010100IC, COLLECTOR CURRENT (mA)1000Figure 3. “On” VoltagesFigure 4. DC Current Gain1000VCE = 5.0 VhFE, DC CURRENT GAIN150°C25°C100–40°C101.010100IC, COLLECTOR CURRENT (mA)1000Figure 5. DC Current Gain 2Motorola Small–Signal Transistors, FETs and Diodes Device Data元器件交易网www.cecb2b.comMINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the totaldesign. The footprint for the semiconductor packages mustbe the correct size to insure proper solder connectionDTA114GEinterface between the board and the package. With thecorrect pad geometry, the packages will self align whensubjected to a solder reflow process.0.5 min. (3x)TYPICALSOLDERING PATTERN0.5 min. (3x)0.5Unit: mm1.4SOT–416/SC–90 POWER DISSIPATIONThe power dissipation of the SOT–416/SC–90 is a functionof the pad size. This can vary from the minimum pad size forsoldering to the pad size given for maximum powerdissipation. Power dissipation for a surface mount device isdetermined by TJ(max), the maximum rated junction tempera-ture of the die, RθJA, the thermal resistance from the devicejunction to ambient; and the operating temperature, TA.Using the values provided on the data sheet, PD can becalculated as follows:PD =TJ(max) – TARθJAthe equation for an ambient temperature TA of 25°C, one cancalculate the power dissipation of the device which in thiscase is 150 milliwatts.PD =150°C – 25°C= 150 milliwatts833°C/WThe values for the equation are found in the maximumratings table on the data sheet. Substituting these values intoThe 833°C/W assumes the use of the recommendedfootprint on a glass epoxy printed circuit board to achieve apower dissipation of 150 milliwatts. Another alternative wouldbe to use a ceramic substrate or an aluminum core boardsuch as Thermal Clad™. Using a board material such asThermal Clad, a higher power dissipation can be achievedusing the same footprint.SOLDERING PRECAUTIONSThe melting temperature of solder is higher than the ratedtemperature of the device. When the entire device is heatedto a high temperature, failure to complete soldering within ashort time could result in device failure. Therefore, thefollowing items should always be observed in order tominimize the thermal stress to which the devices aresubjected.•Always preheat the device.•The delta temperature between the preheat andsoldering should be 100°C or less.*•When preheating and soldering, the temperature of theleads and the case must not exceed the maximumtemperature ratings as shown on the data sheet. Whenusing infrared heating with the reflow soldering method,the difference should be a maximum of 10°C.•The soldering temperature and time should not exceed260°C for more than 10 seconds.•When shifting from preheating to soldering, themaximum temperature gradient should be 5°C or less.•After soldering has been completed, the device shouldbe allowed to cool naturally for at least three minutes.Gradual cooling should be used as the use of forcedcooling will increase the temperature gradient and resultin latent failure due to mechanical stress.•Mechanical stress or shock should not be applied duringcooling.*Soldering a device without preheating can cause excessivethermal shock and stress which can result in damage to thedevice.1Motorola Small–Signal Transistors, FETs and Diodes Device Data 3元器件交易网www.cecb2b.comDTA114GESOLDER STENCIL GUIDELINESPrior to placing surface mount components onto a printedcircuit board, solder paste must be applied to the pads. Asolder stencil is required to screen the optimum amount ofsolder paste onto the footprint. The stencil is made of brassor stainless steel with a typical thickness of 0.008 inches.The stencil opening size for the surface mounted packageshould be the same as the pad size on the printed circuitboard, i.e., a 1:1 registration.TYPICAL SOLDER HEATING PROFILEFor any given circuit board, there will be a group of controlsettings that will give the desired heat pattern. The operatormust set temperatures for several heating zones, and afigure for belt speed. Taken together, these control settingsmake up a heating “profile” for that particular circuit board.On machines controlled by a computer, the computerremembers these profiles from one operating session to thenext. Figure 6 shows a typical heating profile for use whensoldering a surface mount device to a printed circuit board.This profile will vary among soldering systems but it is a goodstarting point. Factors that can affect the profile include thetype of soldering system in use, density and types ofcomponents on the board, type of solder used, and the typeof board or substrate material being used. This profile showstemperature versus time. The line on the graph shows theactual temperature that might be experienced on the surfaceof a test board at or near a central solder joint. The twoprofiles are based on a high density and a low density board.The Vitronics SMD310 convection/infrared reflow solderingsystem was used to generate this profile. The type of solderused was 62/36/2 Tin Lead Silver with a melting pointbetween 177–189°C. When this type of furnace is used forsolder reflow work, the circuit boards and solder joints tend toheat first. The components on the board are then heated byconduction. The circuit board, because it has a large surfacearea, absorbs the thermal energy more efficiently, thendistributes this energy to the components. Because of thiseffect, the main body of a component may be up to 30degrees cooler than the adjacent solder joints.STEP 1PREHEATZONE 1“RAMP”200°CSTEP 2STEP 3VENTHEATING“SOAK”ZONES 2 & 5“RAMP”STEP 5STEP 4HEATINGHEATINGZONES 4 & 7ZONES 3 & 6“SPIKE”“SOAK”170°C160°CSTEP 6STEP 7VENTCOOLING205° TO 219°CPEAK ATSOLDER JOINTDESIRED CURVE FOR HIGHMASS ASSEMBLIES150°C150°C100°C100°C140°CSOLDER IS LIQUID FOR40 TO 80 SECONDS(DEPENDING ONMASS OF ASSEMBLY)50°CDESIRED CURVE FOR LOWMASS ASSEMBLIESTIME (3 TO 7 MINUTES TOTAL)TMAXFigure 6. Typical Solder Heating Profile 4Motorola Small–Signal Transistors, FETs and Diodes Device Data元器件交易网www.cecb2b.comPACKAGE DIMENSIONSDTA114GE–A–S23STYLE 1:PIN 1.BASE 2.EMITTER 3.COLLECTORNOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.DIMABCDGHJKLSMILLIMETERSMINMAX0.700.801.401.800.600.900.150.301.00 BSC–––0.100.100.251.451.750.100.200.50 BSCINCHESMINMAX0.0280.0310.0550.0710.0240.0350.0060.0120.039 BSC–––0.0040.0040.0100.0570.0690.0040.0080.020 BSCG–B–1D3 PL0.20 (0.008)MBK0.20 (0.008)AJCLHCASE 463–01ISSUE ASOT–416/SC–90Motorola Small–Signal Transistors, FETs and Diodes Device Data 5元器件交易网www.cecb2b.comDTA114GEMotorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motoroladata sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights ofothers. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injuryor death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorolaand its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney feesarising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges thatMotorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an EqualOpportunity/Affirmative Action Employer.Mfax is a trademark of Motorola, Inc.How to reach us:USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447Customer Focus Center: 1–800–521–6274Mfax™: RMFAX0@email.sps.mot.com– TOUCHTONE 1–602–244–6609ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,Motorola Fax Back System– US & Canada ONLY 1–800–774–184851 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298– http://sps.motorola.com/mfax/HOME PAGE: http://motorola.com/sps/JAPAN: Nippon Motorola Ltd.; SPD, Strategic Planning Office, 141,4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan. 81–3–5487–8488 6◊DTA114GE/DMotorola Small–Signal Transistors, FETs and Diodes Device Data