专利名称：METHOD OF ASSEMBLING TWO
SUBSTRATES BY MEANS OF BONDING ANDMETHOD OF DISASSEMBLING SAID BONDEDASSEMBLY BY MEANS OF MIGRATION
发明人：ALCORTA, JOSE,PAPON, ERIC,DALET, PIERRE申请号：EP05819008.3申请日：20051103公开号：EP1814935A1公开日：20070808
摘要：The invention relates to a method of assembling a first substrate (10) and asecond substrate (12) by means of bonding with at least one joint (14). The invention ischaracterised in that it comprises the following successive steps consisting in: positioningat least one polymer joint (14) between the first (10) and second (12) substrates, said atleast one joint comprising at least one migrating agent which can migrate to at least oneof the interfaces of the at least one joint in order to generate a layer with low cohesion;pressing the two substrates (10, 12) against one another; and polymerising the at leastone joint (14) in order to obtain a bonded assembly comprising said two substrates (10,12).
申请人：RESCOLL
地址：16, avenue Pey Berland 33600 Pessac FR
国籍：FR
代理机构：Fantin, Laurent
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