www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Orderable DeviceJM38510/31003B2AJM38510/31003BCAJM38510/31003BDAM38510/31003B2AM38510/31003BCAM38510/31003BDA
SN54LS21JSN74LS21DSN74LS21DE4SN74LS21DG4SN74LS21DRSN74LS21DRE4SN74LS21DRG4SN74LS21NSN74LS21N3SN74LS21NE4SN74LS21NSRSN74LS21NSRE4SN74LS21NSRG4SNJ54LS21FKSNJ54LS21JSNJ54LS21W
Status
(1)
Package TypePackage
Drawing
LCCCCDIPCFPLCCCCDIPCFPCDIPSOICSOICSOICSOICSOICSOICPDIPPDIPPDIPSOSOSOLCCCCDIPCFP
FKJWFKJWJDDDDDDNNNNSNSNSFKJW
Pins20141420141414141414141414141414141414201414
Package Qty
11111115050502500250025002525200020002000111
Eco Plan
TBDTBDTBDTBDTBDTBDTBD
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Samples(Requires Login)
ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
POST-PLATEN / A for Pkg Type
A42A42A42A42A42
N / A for Pkg TypeN / A for Pkg TypeN / A for Pkg TypeN / A for Pkg TypeN / A for Pkg Type
POST-PLATEN / A for Pkg Type
Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Pb-Free (RoHS)
TBDPb-Free (RoHS)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)
TBDTBDTBD
CU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAUN / A for Pkg TypeCall TI
Call TI
CU NIPDAUN / A for Pkg TypeCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMPOST-PLATEN / A for Pkg Type
A42A42
N / A for Pkg TypeN / A for Pkg Type
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
(1)
The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS21, SN74LS21 :
•Catalog: SN74LS21•Military: SN54LS21
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
Addendum-Page 2
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PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSOICSO
DNS
1414
SPQ
ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0
16.416.4
6.58.2
B0(mm)9.010.5
K0(mm)2.12.5
P1(mm)8.012.0
WPin1(mm)Quadrant16.016.0
Q1Q1
SN74LS21DRSN74LS21NSR
25002000
PackMaterials-Page1
芯天下--http://oneic.com/
PACKAGEMATERIALSINFORMATION
www.ti.com
14-Jul-2012
*Alldimensionsarenominal
DeviceSN74LS21DRSN74LS21NSR
PackageType
SOICSO
PackageDrawing
DNS
Pins1414
SPQ25002000
Length(mm)
367.0367.0
Width(mm)367.0367.0
Height(mm)
38.038.0
PackMaterials-Page2
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芯天下--http://oneic.com/IMPORTANTNOTICE
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TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.ProductsAudioAmplifiersDataConvertersDLP®ProductsDSP
ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID
OMAPMobileProcessorsWirelessConnectivity
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