专利名称：Method of establishing non-permanent
electrical connection between an integratedcircuit device lead element and a substrate
发明人：Robert L. Canella申请号：US10992384申请日：20041118公开号：US07192806B2公开日：20070320
专利附图：
摘要：A spring contact for establishing electrical contact between a lead element ofan IC device and a substrate. The spring contact generally comprises a contact portion
and a base portion. The contact portion, which generally comprises a coil-type
compression spring, is configured to engage and resiliently bias against a lead element ofthe IC device. The spring contact is disposed in a mating aperture formed in thesubstrate. The base portion of the spring contact is configured to secure the springcontact within the mating aperture and to establish electrical contact with the substrate.A plurality of such spring contacts and mating apertures may be arranged on thesubstrate in an array corresponding to the pin-out of the IC device. A clamping elementsecures the IC device to the substrate and biases the IC device against the springcontacts.
申请人：Robert L. Canella
地址：Nampa ID US
国籍：US
代理机构：TraskBritt
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