专利名称：Lead frame and semiconductor device发明人：Harunobu Sato,Takashi Yoshie,Susumu
Kurashima
申请号：US14221796申请日：20140321公开号：US09466556B2公开日：20161011
专利附图：
摘要：A lead frame includes an outer lead and a plating layer that covers a lowersurface and side surfaces of the outer lead. The plating layer does not cover the uppersurface of the outer lead. A frame base material is exposed from the plating layer at the
upper surface of the outer lead.
申请人：SHINKO ELECTRIC INDUSTRIES CO., LTD.
地址：Nagano-ken JP
国籍：JP
代理机构：Fish & Richardson P.C.
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容