专利名称：Apparatus for subjecting a semiconductor
substrate to a washing process
发明人：Takahito Nakajima,Yuji Fukazawa申请号：US08/401686申请日：19950310公开号：US05571367A公开日：19961105
摘要：An apparatus for subjecting a semiconductor substrate to a washing process isequipped with a hermetically closable chamber for a substrate washing process and awashing process bath provided in the chamber to subject the substrate to the washingprocess. The semiconductor substrate is held in a horizontal state by a substrate supportmechanism provided in the substrate washing process bath. A liquid supply mechanism isprovided for supplying a liquid at least enough great to allow the semiconductorsubstrate to be immersed with the liquid. A chemicals liquid vapor and gas for substratewashing are supplied, by a chemicals component supply mechanism, into the chamber fora predetermined time period so that the chemicals liquid vapor and gas are dissolvedinto the liquid in the process bath to give a solution. The solution thus obtained isreplaced by a pure water replacing mechanism with a specific liquid.
申请人：KABUSHIKI KAISHA TOSHIBA
代理机构：Finnegan, Henderson, Farabow, Garrett & Dunner, LP.
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