专利名称：SEMICONDUCTOR PACKAGE WITH A HEAT
SPREADER AND METHOD OF MAKING
发明人：LEO M. HIGGINS, III申请号：US13205228申请日：20110808
公开号：US20130037931A1公开日：20130214
专利附图：
摘要：An apparatus and method of forming a semiconductor package includes havingand applying, respectively, a thermal interface material on a semiconductor die. Thesemiconductor die is included on a die assembly. The semiconductor die is installed in a
heat spreader. The heat spreader is at least partially filled with mold compound and thesemiconductor die is at least partially immersed in the mold compound once the dieassembly is mounted on the heat spreader. The mold compound is then cured.
申请人：LEO M. HIGGINS, III
地址：Austin TX US
国籍：US
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