Ball grid array type semiconductor package having

专利名称：Ball grid array type semiconductor package

having a flexible substrate

发明人：Atsushi Fujisawa,Takafumi Konno,Shingo

Ohsaka,Ryo Haruta,Masahiro Ichitani

申请号：US10059341申请日：20020131公开号：US06590275B2公开日：20030708

专利附图：

摘要：In a ball grid array type semiconductor package, a semiconductor chip ismounted through an adhesive material on a surface of a flexible film substrate. Plural

bump electrodes are arranged in an array on the opposite side of said substrate and thesemiconductor chip is sealed by a resin. In this regard, an insulation layer is formed tocover an electric conductor layer pattern formed on the surface of the substrate, and thesemiconductor chip is mounted through an adhesive material on the insulation layer. Theinsulation layer is divided into a plural number of parts that are mutually discontinuous inthe area under the semiconductor chip. By this divided insulation layer, a short circuitbetween the semiconductor chip and the electric conductor layer pattern is preventedand a deformation of the substrate that comprises the flexible films is suppressed.

申请人：HITACHI, LTD.,HITACHI HOKKAI SEMICONDUCTOR, LTD.

代理机构：Antonelli,Terry,Stout, & Kraus, LLP

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