专利名称：Embedded RF filter package structure and
method of manufacturing thereof
发明人：Kaustubh Ravindra Nagarkar,Yongjae
Lee,Christopher James Kapusta
申请号：US15246671申请日：20160825公开号：US10333493B2公开日：20190625
专利附图：
摘要：A filter package and method of manufacturing thereof is disclosed. The filterdevice package includes a first dielectric layer having an acoustic wave filter device
attached thereto, the acoustic wave filter device comprising an active area and I/O pads.The filter device package also includes an adhesive positioned between the first dielectriclayer and the acoustic wave filter device to secure the layer to the device, vias formedthrough the first dielectric layer and the adhesive to the I/O pads of the acoustic wavefilter device, and metal interconnects formed in the vias and mechanically and electricallycoupled to the I/O pads of the acoustic wave filter device to form electrical
interconnections thereto, wherein an air cavity is formed in the adhesive between theacoustic wave filter device and the first dielectric layer, in a location adjacent the activearea of the acoustic wave filter device.
申请人：General Electric Company
地址：Schenectady NY US
国籍：US
代理机构：Ziolkowski Patent Solutions Group, SC
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