General Specifications
C0G (NP0) is the most popular formulation of the “tempera-ture-compensating,” EIA Class I ceramic materials. ModernC0G (NP0) formulations contain neodymium, samarium andother rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitordielectrics available. Capacitance change with temperatureis 0 ±30ppm/°C which is less than ±0.3% ∆C from -55°Cto +125°C. Capacitance drift or hysteresis for C0G (NP0)ceramics is negligible at less than ±0.05% versus up to±2% for films. Typical capacitance change with life is lessthan ±0.1% for C0G (NP0), one-fifth that shown by mostother dielectrics. C0G (NP0) formulations show no agingcharacteristics.
The C0G (NP0) formulation usually has a “Q” in excess of 1000 and shows little capacitance or “Q” changes withfrequency. Their dielectric absorption is typically less than0.6% which is similar to mica and most films.
PART NUMBER (see page 3 for complete part number explanation)
0805Size(L\" x W\")5Voltage25V = 350V = 5100V = 1200V = 2ADielectricC0G (NP0) = A101CapacitanceCodeJCapacitanceTolerancePreferredK = ±10%J = ±5%AFailureRateA = NotApplicableTTerminationsT = Plated Niand Solder2Packaging2 = 7\" Reel4 = 13\" Reel ASpecialCodeA = Std.ProductPERFORMANCE CHARACTERISTICS
Capacitance RangeCapacitance Tolerances
0.5 pF to .1 µF (1.0 ±0.2 Vrms, 1kHz, for ≤100 pF use 1 MHz)Preferred ±5%, ±10%
others available: ±.25 pF, ±.5 pF, ±1% (≥25pF), ±2%(≥13pF), ±20%For values ≤10 pF preferred tolerance is ±.5 pF, also available ±.25 pF.-55°C to +125°C0 ±30 ppm/°C (EIA C0G)25, 50, 100 & 200 VDC (+125°C)
For values >30 pF: 0.1% max. (+25°C and +125°C)For values ≤30 pF: “Q” = 400 + 20 x C (C in pF)
100,000 megohms min. or 1000 MΩ- µF min., whichever is less10,000 megohms min. or 100 MΩ- µF min., whichever is less250% of rated voltage for 5 seconds at 50 mamp max. current1 ±0.2 Vrms
For values ≤100 pF: 1 MHzFor values >100 pF: 1 KHz
Operating Temperature RangeTemperature CharacteristicVoltage Ratings
Dissipation Factor and “Q”
Insulation Resistance(+25°C, RVDC)Insulation Resistance(+125°C, RVDC)Dielectric StrengthTest VoltageTest Frequency
4
C0G (NP0) Dielectric
Typical Characteristic Curves**
Temperature CoefficientTypical Capacitance ChangeEnvelope: 0 ± 30 ppm/°CVariation of Impedance with Cap ValueImpedance vs. Frequency0805 - C0G (NP0)10 pF vs. 100 pF vs. 1000 pF100,00010,000% ⌬ Capacitance+0.5Impedance, ⍀0-0.51,00010010.01.00.1100 pF1000 pF110100100010 pF-55-35-15+5+25+45+65+85+105+125Temperature °C⌬ Capacitance vs. Frequency+2Frequency, MHz% ⌬ Capacitance+10-1-2Variation of Impedance with Chip SizeImpedance vs. Frequency1000 pF - C0G (NP0)1012060805181212101.01KHz10 KHz100 KHz1 MHz10 MHz0.1101001000FrequencyImpedance, ⍀Insulation Resistance (Ohm-Farads)Insulation Resistance vs Temperature10,000Frequency, MHz1,000Variation of Impedance with Ceramic FormulationImpedance vs. Frequency1000 pF - C0G (NP0) vs X7R080510.00X7RNPO100Impedance, ⍀+20+25+40+60+80+1001.000.100Temperature °C0.01101001000Frequency, MHzSUMMARY OF CAPACITANCE RANGES VS. CHIP SIZEStyle0402*05040603*0805*1206*1210*150518081812*1825*2220222525V0.5pF - 220pF0.5pF - 330pF0.5pF - 1nF0.5pF - 4.7nF0.5pF - 10nF560pF - 10nF—¡1nF - 15nF¡¡¡50V0.5pF - 120pF0.5pF - 150pF0.5pF - 1nF0.5pF - 2.2nF0.5pF - 4.7nF560pF - 10nF10pF - 1.5nF1nF - 4.7nF1nF - 10nF1nF - 22nF4.7nF - 47nF1nF - 100nF100V—0.5pF - 68pF0.5pF - 330pF0.5pF - 1nF0.5pF - 2.2nF560pF - 3.9nF10pF - 820pF1nF - 3.9nF1nF - 4.7nF1nF - 12nF4.7nF - 39nF1nF - 39nF200V———0.5pF - 470pF0.5pF - 1nF560pF - 1.5nF10pF - 560pF1nF - 2.2nF1nF - 3.3nF1nF - 6.8nF3.3nF - 27nF1nF - 39nF*Standard Sizes**For additional information on performance changes with operating conditions consult AVX’s software SpiCap.5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZEStandard Reel PackagingMM(in.)MM(W)Width(in.)MM(T)Max. Thickness(in.)MM(t)Terminal(in.)(L)LengthWVDCCap(pF)0.51.01.21.51.82.22.7᭢0402*All Paper1.00 ±.10(.040 ±.004).50 ±.10(.020 ±.004).60(.024).25 ±.15(.010 ±.006)2550250504*All Embossed1.27 ±.25(.050 ±.010)1.02 ±.25(.040 ±.010)1.02(.040).38 ±.13(.015 ±.005)50100250603*All Paper1.60 ±.15(.063 ±.006).81 ±.15(.032 ±.006).90(.035).35 ±.15(.014 ±.006)50100250805Paper/Embossed2.01 ±.20(.079 ±.008)1.25 ±.20(.049 ±.008)1.30(.051).50 ±.25(.020 ±.010)50100200251206Paper/Embossed3.20 ±.20(.126 ±.008)1.60 ±.20(.063 ±.008)1.50(.059).50 ±.25(.020 ±.010)50100200᭢1505All Embossed3.81 ±.25(.150 ±.010)1.27 ±.25(.050 ±.010)1.27(.050).50 ±.25(.020 ±.010)50100᭢2003.33.94.75.66.88.210121518222733394756688210012015018022027033039047056068082010001200150018002200270033003900470056006800820010000t*Reflow soldering only.NOTES: For higher voltage chips, see pages 20 and 21.= Paper Tape= Embossed Tape6᭢᭢᭢L᭢W᭢TC0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADEDSIZEStandard Reel Packaging(L)Length(W)Width(T)Max. Thickness(t)TerminalWVDCCap(pF)560680820100012001500180022002700330039004700560068008200Cap.(µF).010.012.015.018.022.027.033.039.047.068.082.1MM(in.)MM(in.)MM(in.)MM(in.)1210Paper/Embossed3.20 ±.20(.126 ±.008)2.50 ±.20(.098 ±.008)1.70(.067).50 ±.25(.020 ±.010)25 50 100200 1808*All Embossed4.57 ±.25(.180 ±.010)2.03 ±.25(.080 ±.010)1.52(.060).64 ±.39(.025 ±.015)50 1001812*All Embossed4.50 ±.30(.177 ±.012)3.20 ±.20(.126 ±.008)1.70(.067).61 ±.36(.024 ±.014)50 1001825*All Embossed4.50 ±.30(.177 ±.012)6.40 ±.40(.252 ±.016)1.70(.067).61 ±.36(.024 ±.014)200 501002002220*All Embossed5.7 ±.40(.225 ±.016)5.0 ±.40(.197 ±.016)2.30(.090).64 ±.39(.025 ±.015)100200᭢2225*All Embossed5.72 ±.25(.225 ±.010)6.35 ±.25(.250 ±.010)1.70(.067).64 ±.39(.025 ±.015)50100 200᭢2002550t*Reflow soldering only.NOTES: For higher voltage chips, see pages 20 and 21.᭢= Paper Tape= Embossed Tape᭢᭢L᭢W᭢T᭢7How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805Size(L\" x W\")0402050406030805100509071206121015051805180818121825222536405ADielectricC0G (NP0) = AX7R = CX5R = DZ5U = EY5V = G101JCapacitanceTolerance=±.25 pF*=±.50 pF*=±1% (≥25 pF)=±2% (≥13 pF)=±5%=±10%=±20%=+80%, -20%=+100%, -0%ATTerminations2ASpecial**CodeA = StandardProductNon-StandardP = EmbossedunmarkedM = Embossed markedE = Standard packaging markedLow ProfileChips OnlyMax. ThicknessT = .66mm (.026\")S = .56mm (.022\")R = .46mm (.018\")CDFGJKMZPStandard:T = Ni and TinPlatedOthers:7 = Plated NiGold Plated1 = Pd/AgVoltage10V=Z16V=Y25V=350V=5100V=1200V=2250V = V500V=7600V=C1000V=A1500V=S2000V=G2500V=W3000V=H4000V=J5000V=K
CapacitanceCode(2 significantdigits + no. ofzeros)Examples:10 pF=100100 pF=1011,000 pF=10222,000 pF=223220,000 pF=224
1 µF=105For values below 10 pF,use “R” in place of
decimal point, e.g., 9.1pfd = 9R1.
FailureRateA = NotApplicablePackaging**Recommended:
2=7\" Reel4=13\" ReelOthers:
7=Bulk Cassette9=Bulk
*C&D tolerances for Յ10 pF values.
**Standard Tape and Reel material depends upon chip size and thickness.See individual part tables for tape material type for each capacitance value.
Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.
Standard packaging is shown in the individual tables.
Non-standard packaging is available on special request, please contact AVX.
3
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-der filets and minimize component movement during reflowsoldering. Pad designs are given below for the most com-mon sizes of multilayer ceramic capacitors for both waveand reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible todecrease this to as low as 85% of component width but itis not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and1.0mm for wave soldering.
REFLOW SOLDERING
Case Size0402060308051206121018081812182522202225D11.70 (0.07)2.30 (0.09)3.00 (0.12)4.00 (0.16)4.00 (0.16)5.60 (0.22)5.60 (0.22)5.60 (0.22)6.60 (0.26)6.60 (0.26)D2D20.60 (0.02)0.80 (0.03)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04))1.00 (0.04)1.00 (0.04)1.00 (0.04)D30.50 (0.02)0.70 (0.03)1.00 (0.04)2.00 (0.09)2.00 (0.09)3.60 (0.14)3.60 (0.14)3.60 (0.14)4.60 (0.18)4.60 (0.18)D40.60 (0.02)0.80 (0.03)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)1.00 (0.04)D50.50 (0.02)0.75 (0.03)1.25 (0.05)1.60 (0.06)2.50 (0.10)2.00 (0.08)3.00 (0.12)6.35 (0.25)5.00 (0.20)6.35 (0.25)D1D3D4D5Dimensions in millimeters (inches)41
Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
D2D1D3D4Case Size0603080512061210D5D13.10 (0.12)4.00 (0.15)5.00 (0.19)5.00 (0.19)D21.20 (0.05)1.50 (0.06)1.50 (0.06)1.50 (0.06)D30.70 (0.03)1.00 (0.04)2.00 (0.09)2.00 (0.09)D41.20 (0.05)1.50 (0.06)1.50 (0.06)1.50 (0.06)D50.75 (0.03)1.25 (0.05)1.60 (0.06)2.50 (0.10)Dimensions in millimeters (inches)Component Spacing
For wave soldering components, must be spaced sufficientlyfar apart to avoid bridging or shadowing (inability of solderto penetrate properly into small spaces). This is less impor-tant for reflow soldering but sufficient space must beallowed to enable rework should it be required.
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to prevent thermal shock. A better maximum figure is about2°C/second.
For capacitors size 1206 and below, with a maximum thickness of 1.25mm, it is generally permissible to allow atemperature differential from preheat to soldering of 150°C.In all other cases this differential should not exceed 100°C.For further specific application or process advice, pleaseconsult AVX.
≥1.5mm (0.06)≥1mm (0.04)Cleaning
Care should be taken to ensure that the capacitors arethoroughly cleaned of flux residues especially the spacebeneath the capacitor. Such residues may otherwisebecome conductive and effectively offer a low resistancebypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended conditions being 8 Watts/litre at 20-45 kHz, with a processcycle of 2 minutes vapor rinse, 2 minutes immersion in theultrasonic solvent bath and finally 2 minutes vapor rinse.
≥1mm (0.04)42
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months,provided the components are stored in their “as received”packaging at less than 40°C and 70% RH.
General
Surface mounting chip multilayer ceramic capacitors are designed for soldering to printed circuit boards or othersubstrates. The construction of the components is such thatthey will withstand the time/temperature profiles used in bothwave and reflow soldering methods.Solderability
Terminations to be well soldered after immersion in a 60/40tin/lead solder bath at 235 ±5°C for 2±1 seconds.
HandlingChip multilayer ceramic capacitors should be handled withcare to avoid damage or contamination from perspirationand skin oils. The use of tweezers or vacuum pick ups is strongly recommended for individual components. Bulkhandling should ensure that abrasion and mechanical shockare minimized. Taped and reeled components provides theideal medium for direct presentation to the placementmachine. Any mechanical shock should be minimized duringhandling chip multilayer ceramic capacitors.Leaching
Terminations will resist leaching for at least the immersiontimes and conditions shown below.Termination TypeNickel BarrierSolderSolderTin/Lead/SilverTemp. °C60/40/0260±5Immersion TimeSeconds30±1PreheatRecommended Soldering Profiles
Reflow
300250200150100 50 0220°Cto250°CPreheatNaturalCoolingSolder Temp.It is important to avoid the possibility of thermal shock duringsoldering and carefully controlled preheat is thereforerequired. The rate of preheat should not exceed 4°C/secondand a target figure 2°C/second is recommended. Althoughan 80°C to 120°C temperature differential is preferred,recent developments allow a temperature differentialbetween the component surface and the soldering temper-ature of 150°C (Maximum) for capacitors of 1210 size andbelow with a maximum thickness of 1.25mm. The user iscautioned that the risk of thermal shock increases as chipsize or temperature differential increases.SolderingMildly activated rosin fluxes are preferred. The minimumamount of solder to give a good joint should be used.Excessive solder can lead to damage from the stressescaused by the difference in coefficients of expansionbetween solder, chip and substrate. AVX terminations aresuitable for all wave and reflow soldering systems. If handsoldering cannot be avoided, the preferred technique is theutilization of hot air soldering tools.1min1min10 sec. max(Minimize soldering time)
Wave
300250200150100 50 0PreheatNaturalCoolingCoolingNatural cooling in air is preferred, as this minimizes stresseswithin the soldered joint. When forced air cooling is used,cooling rate should not exceed 4°C/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above.Solder Temp.T230°Cto250°CCleaningFlux residues may be hygroscopic or acidic and must beremoved. AVX MLC capacitors are acceptable for use withall of the solvents described in the specifications MIL-STD-202 and EIA-RS-198. Alcohol based solvents are acceptableand properly controlled water cleaning systems are alsoacceptable. Many other solvents have been proven successful,and most solvents that are acceptable to other componentson circuit assemblies are equally acceptable for use withceramic capacitors.1 to 2 min3 sec. max(Preheat chips before soldering)T/maximum 150°C
43
Packaging of ChipComponents
Automatic Insertion Packaging
TAPE &REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mmPaper or Embossed CarrierEmbossed OnlyPaper OnlyQty. per Reel/7\" ReelQty. per Reel/13\" Reel(1)12mm0805, 1005, 1206,12100504, 09070402, 06032,000 or 4,000(1)10,0003,00010,0001,0004,0001505, 1805, 18081812, 18252220, 2225Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7\" reel. 0402 size chips are 10,000 per 7\" reels and arenot available on 13\" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
TapeSize(1)8mmAMax.B*Min.CD*Min.NMin.W18.4+1.0–0.0(.331+.060–0.0)W2Max.14.4(.567)W37.9 Min.(.311)10.9 Max.(.429)11.9 Min.(.469)15.4 Max.(.607)330(12.992)12mm1.5(.059)13.0±0.20(.512±.008)20.2(.795)50(1.969)12.4+2.0–0.0+.076(.488–0.0)18.4(.724)Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
32
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mmEmbossed TapeMetric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size8mmand12mmD08.4+0.10-0.0(.059+.004-0.0)EP0P2TMax.0.600(.024)T10.10(.004)Max.G10.75(.030)Min.See Note 3G20.75(.030)Min.SeeNote 41.75 ±0.104.0 ±0.102.0 ±0.05(.069 ±.004)(.157 ±.004)(.079 ±.002)VARIABLE DIMENSIONSTape SizeB1D1Max.Min.See Note 6See Note 54.55(.179)8.2(.323)4.55(.179)8.2(.323)1.0(.039)1.5(.059)1.0(.039)1.5(.059)FP1RMin.See Note 225(.984)30(1.181)25(.984)30(1.181)T2WA0 B0 K08mm3.5 ±0.054.0 ±0.10(.138 ±.002)(.157 ±.004)5.5 ±0.054.0 ±0.10(.217 ±.002)(.157 ±.004)3.5 ±0.052.0 ±0.10(.138 ±.002)0.79 ±.0045.5 ±0.058.0 ±0.10(.217 ±.002)(.315 ±.004)2.5 Max(.098)6.5 Max.(.256)2.5 Max.(.098)6.5 Max.(.256)8.0+0.3-0.1(.315+.012 -.004 )12.0 ±.30(.472 ±.012)8.0+0.3-0.1(.315+.012 -.004 )12.0 ±.30(.472 ±.012)See Note 112mm8mm1/2 Pitch12mmDoublePitchSee Note 1See Note 1See Note 1NOTES:
1. A0, B0, and K0are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. Theclearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C &D).2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mmembossed tape for reels with hub diameters approaching N min. (Table 4).3. G1dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less.4. G2dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less.5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.Dimensions of embossment location and hole location shall be applied independent of each other.6. B1dimension is a reference dimension for tape feeder clearance only.
33
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mmPaper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONSTape Size8mmand12mmD0+0.11.5 -0.0+.004)(.059-.000E1.75 ±0.10(.069 ±.004)P0P2T10.10(.004)Max.G10.75(.030)Min.G20.75(.030)Min.R MIN.25 (.984)See Note 24.0 ±0.102.0 ±0.05(.157 ±.004)(.079 ±.002)VARIABLE DIMENSIONSTape Size8mmP14.0 ±0.10(.157 ±.004)4.0 ±.010(.157 ±.004)2.0 ±0.10(.079 ±.004)8.0 ±0.10(.315 ±.004)F3.5 ±0.05(.138 ±.002)5.5 ±0.05(.217 ±.002)3.5 ±0.05(.138 ±.002)5.5 ±0.05(.217 ±.002)W8.0+0.3-0.1(.315+.012 -.004 )12.0 ±0.3(.472 ±.012)8.0+0.3-0.1(.315+.012 -.004 )12.0 ±0.3(.472 ±.012)A0 B0See Note 1TSee Note 312mm8mm1/2 Pitch12mmDoublePitchNOTES:
1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. Theclearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A &B).2. Tape with components shall pass around radius “R” without damage.
3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556-A.
34
Bulk Case Packaging
BENEFITS
• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
BULK FEEDER
• Easier inventory control• Flexibility• Recyclable
CaseCassetteGateCASE DIMENSIONS
Slider12mm36mmExpanded Drawing110mmAttachment BaseShutterShooterMounterHeadChipsCASE QUANTITIES
Part SizeQty.(pcs / cassette)040280,000060315,000080510,000 (T=0.6mm)5,000 (T¯≥0.6mm)35
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