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MC74AC125MELG资料

2022-12-24 来源:乌哈旅游
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MC74AC125, MC74ACT125Quad Buffer with 3−StateOutputs

Features

•Outputs Source/Sink

•′ACT125 Has TTL Compatible Inputs•Pb−Free Packages are Available

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VCC14A213B212O211A310B39O38141PDIP−14N SUFFIXCASE 646

141A0

2B0

3O0

4A1

5B1

6O1

7GND

1SOIC−14D SUFFIXCASE 751A

Figure 1. Pinout: 14−Lead Packages Conductors

(Top View)

141TSSOP−14DT SUFFIXCASE 948G

PIN ASSIGNMENT

PINAn, BnOn

FUNCTIONInputsOutputs

141SOEIAJ−14M SUFFIXCASE 965

FUNCTION TABLE

InputsAn

Bn

OutputOnLHZ

ORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 5 of this data sheet.

LLLHHX

NOTE:H = High Voltage Level;

L = Low Voltage Level;Z = High Impedance;X = Immaterial

DEVICE MARKING INFORMATION

See general marking information in the device markingsection on page 5 of this data sheet.

© Semiconductor Components Industries, LLC, 2006

October, 2006 − Rev. 7

1

Publication Order Number:

MC74AC125/D

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MC74AC125, MC74ACT125

MAXIMUM RATINGS

SymbolVCCVinVoutIinIoutICCTstg

Parameter

DC Supply Voltage (Referenced to GND)DC Input Voltage (Referenced to GND)DC Output Voltage (Referenced to GND)DC Input Current, per Pin

DC Output Sink/Source Current, per PinDC VCC or GND Current per Output PinStorage Temperature

Value−0.5 to +7.0−0.5 to VCC + 0.5−0.5 to VCC + 0.5

±󰀀20±󰀀50±󰀀50−65 to +150

UnitVVVmAmAmA°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.

RECOMMENDED OPERATING CONDITIONS

SymbolVCCVin, Vouttr, tfTJTAIOHIOL

Supply Voltage

DC Input Voltage, Output Voltage (Ref. to GND)Input Rise and Fall Time (Note 1)′AC Devices except Schmitt InputsJunction Temperature (PDIP)

Operating Ambient Temperature RangeOutput Current − HIGHOutput Current − LOW

VCC @ 3.0 VVCC @ 4.5 VVCC @ 5.5 V

Parameter

′AC′ACT

Min2.04.50−−−−−40−−

Typ5.05.0−1504025−25−−

Max6.05.5VCC−−−14085−2424

°C°CmAmAns/VUnitVV

1.Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.2.Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

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MC74AC125, MC74ACT125

DC CHARACTERISTICS

74AC

Symbol

Parameter

VCC(V)

TA = +25°CTyp1.52.252.751.52.252.752.994.465.49−−−0.0020.0010.001−−−−−−−−

74ACTA =−40°C to+85°C

Unit

Conditions

VIH

Minimum High LevelInput VoltageMaximum Low LevelInput VoltageMinimum High LevelOutput Voltage

VIL

VOH

3.04.55.53.04.55.53.04.55.53.04.55.53.04.55.53.04.55.5

Guaranteed Limits2.12.13.153.153.853.850.90.91.351.351.651.652.92.94.44.45.45.42.563.864.860.10.10.10.360.360.36±0.1±0.5−−8.0

2.463.764.760.10.10.10.440.440.44±1.0±5.075−7580

V

VOUT = 0.1 Vor VCC − 0.1 VVOUT = 0.1 Vor VCC − 0.1 VIOUT = −50 mAV

V

V

VOL

Minimum Low LevelOutput Voltage

V

*VIN = VIL or VIH

−12 mA

IOH−24 mA

−24 mA

IOUT = 50 mAV

IINIOZ

Maximum InputLeakage CurrentVI (OE) = VIL, VIHVI = VCC, GNDVO = VCC , GND†Minimum DynamicOutput CurrentMaximum QuiescentSupply Current

5.55.55.55.55.5

mAmAmAmAmA

*VIN = VIL or VIH

12 mA

IOL24 mA

24 mA

VI = VCC, GNDVI (OE) = VIL, VIHVI = VCC, GNDVO = VCC, GNDVOLD = 1.65 V MaxVOHD = 3.85 V MinVIN = VCC or GNDIOLDIOHDICC

*All outputs loaded; thresholds on input associated with output under test.†Maximum test duration 2.0 ms, one input loaded at a time.

NOTE:IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.

AC CHARACTERISTICS

74AC

Symbol

Parameter

VCC*(V)

TA = +25°CCL = 50 pFMin1.01.01.01.01.01.01.01.01.01.01.01.0

Max9.07.09.07.010.57.0108.0109.010.59.0

74ACTA = −40°Cto +85°CCL = 50 pFMin1.01.01.01.01.01.01.01.01.01.01.01.0

Max107.5107.5118.0118.510.59.511.59.5

Unit

tPLHtPHLtPZHtPZLtPHZtPLZ

Propagation DelayData to OutputPropagation DelayData to OutputOutput EnableTime

Output EnableTime

Output DisableTime

Output DisableTime

*Voltage Range 3.3 V is 3.3 V ±0.3 V.Voltage Range 5.0 V is 5.0 V ±0.5 V.

3.35.03.35.03.35.03.35.03.35.03.35.0

nsnsnsnsnsns

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MC74AC125, MC74ACT125

DC CHARACTERISTICS

74ACT

Symbol

Parameter

VCC(V)

TA = +25°CTyp1.51.51.51.54.495.49−−0.0010.001−−−−0.6−−

74ACTTA =−40°C to+85°C

Unit

Conditions

VIHVILVOH

Minimum High LevelInput VoltageMaximum Low LevelInput VoltageMinimum High LevelOutput Voltage4.55.54.55.54.55.54.55.54.55.54.55.5

Guaranteed Limits2.22.02.02.00.80.80.80.84.44.45.45.43.864.860.10.10.360.36±0.1±0.5−−−8.03.764.760.10.10.440.44±1.0±5.01.575−7580VVVVVVmAmAmAmAmAmA

VOUT = 0.1 Vor VCC − 0.1 VVOUT = 0.1 Vor VCC − 0.1 VIOUT = −50 mA*VIN = VIL or VIH

−24 mA

IOH

−24 mA

IOUT = −50 mA*VIN = VIL or VIHIOH−24 mA

−24 mA

VI = VCC, GNDVI (OE) = VIL, VIHVI = VCC, GNDVO = VCC, GNDVI = VCC −2.1 VVOLD = 1.65 V MaxVOHD = 3.85 V MinVIN = VCC or GNDVOL

Minimum Low LevelOutput Voltage

IINIOZ

Maximum InputLeakage CurrentVI (OE) = VIL, VIHVI = VCC, GNDVO = VCC , GNDAdditional Max. ICC/Input†Minimum DynamicOutput Current

5.55.55.55.55.5

DICCTIOLDIOHD

ICCMaximum Quiescent Supply Current5.5−*All outputs loaded; thresholds on input associated with output under test.†Maximum test duration 2.0 ms, one input loaded at a time.

AC CHARACTERISTICS

74ACT

Symbol

Parameter

VCC*(V)

TA = +25°CCL = 50 pFMin

tPLHtPHLtPZHtPZLtPHZtPLZ

Propagation DelayData to OutputPropagation DelayData to OutputOutput EnableTime

Output EnableTime

Output DisableTime

5.05.05.05.05.05.0

1.01.01.01.01.01.0

Max9.09.08.59.59.510

74ACTTA = −40°Cto +85°CCL = 50 pFMin1.01.01.01.01.01.0

Max10109.510.510.510.5

nsnsnsnsnsnsUnit

Output DisableTime

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

SymbolCINCPD

Input Capacitance

Power Dissipation Capacitance

Parameter

ValueTyp4.545

UnitpFpF

Test ConditionsVCC = 5.0 VVCC = 5.0 V

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MC74AC125, MC74ACT125

ORDERING INFORMATION

Device

MC74AC125NMC74AC125NGMC74AC125DMC74AC125DGMC74AC125DR2MC74AC125DR2GMC74AC125DTR2MC74AC125DTR2GMC74AC125MMC74AC125MGMC74AC125MELMC74AC125MELGMC74ACT125DR2MC74ACT125DR2GMC74ACT125DTR2MC74ACT125DTR2GMC74ACT125MELMC74ACT125MELGMC74ACT125NMC74ACT125NG

PackagePDIP−14PDIP−14(Pb−Free)SOIC−14SOIC−14(Pb−Free)SOIC−14SOIC−14(Pb−Free)TSSOP−14*TSSOP−14*SOEIAJ−14SOEIAJ−14(Pb−Free)SOEIAJ−14SOEIAJ−14(Pb−Free)SOIC−14SOIC−14(Pb−Free)TSSOP−14*TSSOP−14*SOEIAJ−14SOEIAJ−14(Pb−Free)PDIP−14PDIP−14(Pb−Free)

25 Units / Rail2000 / Tape & Reel2500 / Tape & Reel2000 / Tape & Reel50 Units / Rail2500 / Tape & Reel55 Units / Rail25 Units / RailShipping†

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.*This package is inherently Pb−Free.

MARKING DIAGRAMS

PDIP−14

14MC74AC125NAWLYYWWG1114ACT125GAWLYWW11

14AC125GAWLYWW114

SOIC−14

14TSSOP−14

14AC125ALYWGG114

ACT125ALYWGG1

74ACT125ALYWG74AC125ALYWGSOEIAJ−14

A= Assembly LocationL, WL= Wafer LotY, YY= Year

W, WW= Work Week

G orG= Pb−Free Package

(Note: Microdot may be in either location)

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MC74AC125, MC74ACT125

PACKAGE DIMENSIONS

PDIP−14CASE 646−06ISSUE P

148B17NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.4.DIMENSION B DOES NOT INCLUDE MOLD FLASH.5.ROUNDED CORNERS OPTIONAL.INCHESMINMAX0.7150.7700.2400.2600.1450.1850.0150.0210.0400.0700.100 BSC0.0520.0950.0080.0150.1150.1350.2900.310−−−10 _0.0150.039MILLIMETERSMINMAX18.1619.566.106.603.694.690.380.531.021.782.54 BSC1.322.410.200.382.923.437.377.87−−−10 _0.381.01AFN−T−SEATINGPLANELCHGD14 PLKMJMDIMABCDFGHJKLMN0.13 (0.005)http://onsemi.com

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MC74AC125, MC74ACT125

PACKAGE DIMENSIONS

SOIC−14CASE 751A−03

ISSUE H

−A−148−B−P7 PL0.25 (0.010)MBM17NOTES:

1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS A AND B DO NOT INCLUDEMOLD PROTRUSION.

4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.

5.DIMENSION D DOES NOT INCLUDEDAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.127(0.005) TOTAL IN EXCESS OF THE DDIMENSION AT MAXIMUM MATERIALCONDITION.

GC−T−SEATINGPLANERX 45_FD14 PL0.25 (0.010)KMMSJTBASDIMABCDFGJKMPRMILLIMETERSMINMAX8.558.753.804.001.351.750.350.490.401.251.27 BSC0.190.250.100.250 7 __5.806.200.250.50INCHESMINMAX0.3370.3440.1500.1570.0540.0680.0140.0190.0160.0490.050 BSC0.0080.0090.0040.0090 7 __0.2280.2440.0100.019SOLDERING FOOTPRINT*7X7.0410.5814X14X1.521.27PITCHDIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

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MC74AC125, MC74ACT125

PACKAGE DIMENSIONS

TSSOP−14CASE 948G−01

ISSUE B

14X REFK

0.10 (0.004)0.15 (0.006)TUSMTUSVNS2XL/21480.25 (0.010)MLPIN 1IDENT.17B−U−NFDETAIL EKK10.15 (0.006)TUSNOTES:

1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLDFLASH, PROTRUSIONS OR GATE BURRS.MOLD FLASH OR GATE BURRS SHALL NOTEXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALLNOT EXCEED 0.25 (0.010) PER SIDE.

5.DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTALIN EXCESS OF THE K DIMENSION ATMAXIMUM MATERIAL CONDITION.

6.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7.DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

DIMABCDFGHJJ1KK1LM

MILLIMETERSMINMAX4.905.104.304.50−−−1.200.050.150.500.750.65 BSC0.500.600.090.200.090.160.190.300.190.256.40 BSC0 8 __INCHES

MINMAX0.1930.2000.1690.177−−−0.0470.0020.0060.0200.0300.026 BSC0.0200.0240.0040.0080.0040.0060.0070.0120.0070.0100.252 BSC0 8 __A−V−JJ1SECTION N−N−W−C0.10 (0.004)−T−SEATINGPLANEDGHDETAIL ESOLDERING FOOTPRINT*

7.0610.65PITCH

0.36

14X

14X1.26DIMENSIONS: MILLIMETERS*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

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MC74AC125, MC74ACT125

PACKAGE DIMENSIONS

SOEIAJ−14CASE 965−01ISSUE A

148LEQ1EHEM_LDETAIL P17ZDeAVIEW PNOTES:

1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.

3.DIMENSIONS D AND E DO NOT INCLUDE MOLDFLASH OR PROTRUSIONS AND ARE MEASUREDAT THE PARTING LINE. MOLD FLASH ORPROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)PER SIDE.4.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.5.THE LEAD WIDTH DIMENSION (b) DOES NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWERRADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEADTO BE 0.46 ( 0.018).DIMAA1bcDEeHE0.50LEMQ1ZMILLIMETERSMINMAX−−−2.050.050.200.350.500.100.209.9010.505.105.451.27 BSC7.408.200.500.851.101.500 _10 _0.700.90−−−1.42INCHESMINMAX−−−0.0810.0020.0080.0140.0200.0040.0080.3900.4130.2010.2150.050 BSC0.2910.3230.0200.0330.0430.0590 _10 _0.0280.035−−−0.056cb0.13 (0.005)MA10.10 (0.004)ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: orderlit@onsemi.comN. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:Phone: 421 33 790 2910Japan Customer Focus CenterPhone: 81−3−5773−3850ON Semiconductor Website: www.onsemi.comOrder Literature: http://www.onsemi.com/orderlitFor additional information, please contact your localSales Representativehttp://onsemi.com9MC74AC125/D

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